Wafer-level replication, stacking and singulation ensures scalability and reliability
Compact and thin: reduced z-height for integration in slim consumer devices
Customizable beam shaping: dot arrays, line patterns, logos, and freeform designs
Wide divergence control: typical 10° – 120° projection angles
High transmission efficiency: optimized micro-structures with AR coating options
Thermal and mechanical stability: resistant to high temperature and reflow processes
Key Specifications
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Design Format |
2–7 wafer-stacked layers |
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Wavelength Range |
400 – 2000 nm (VIS–NIR; UV/MWIR on request) |
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Light Sources |
VCSEL, LED, or diode laser |
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Projection Angles (FOV) |
10° – 120° (typical) |
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Pattern Types |
Dot matrix, grid, lines, logos, freeform patterns |
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Optical Efficiency |
>85% (typical, with AR coating) |
|
Module Thickness |
<1 mm – 3 mm (typical) |
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Thermal Stability |
–40 °C to +125 °C, reflow-compatible |
|
Applications |
3D sensing, AR/VR/AI glass, in-cabin sensing, automotive projected lighting, robotics |
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